Similar words: application layer, presentation layer, insulation, session layer, inversion layer, insulation material, insulating material, insulating materials.
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1. The breakdown of the insulation layer short-circuits nerve impulses and produces devastating consequences.
2. Industrial furnace wall lining, masonry insulation layer.
3. Maybe high blood glucose levels damage the insulation layer of cells around the nerves.
4. Using high - quality glass wool insulation layer boards, good thermal insulation properties.
5. Septum formed by the built-in vapor barrier, insulation layer that is vapor layer is separated, without a separate isolation air layer.
6. Recovery and sulfuration of crosslinked polythene insulation layer of cable joint.
7. The structure and fabrication of double - insulation layer tunnel junction ( MIMIS ) are introduced.
8. Fiber insulation layer structure, glass fiber loss , the wind, rusty easy for breeding bacteria.
9. In addition, an insulation layer is formed for covering the electronic emission sources and the anodic treatment layer.
10. For the good performance of the insulation layer extruded foam board.
11. Transition Insulation ? is a light and flexible insulation layer.
11. Wish you can benefit from sentencedict.com and make progress everyday!
12. The grid insulation layer is arranged on the base - plate and covers the grid electrode.
13. The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
14. In addition an insulation layer should be built in interior building structure for moisture proof.
15. By means of temperature determination, the reconstructed insulation layer has reached the requirement of relative standard.
16. The ring - shaped source electrode is configured on the grid insulation layer.
17. Overlapping method applies out electric field to electrodeposit, and uses the insulation layer to prevent the crystal particle between the layers from growing.
18. The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
19. The semiconductor device includes a isolated layer protruding from a substrate, a separator, a tunnel insulation layer, a floating grid, a dielectric layer pattern and a control grid.
20. Develops the mathematic model and program for the optimization design of insulation layer thickness.
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